The future of high temperature interconnect

The project

The ELCOSINT project focussed on high temperature electronics.  Its aim to have significant impact on energy efficiency and the environment.
In order to achieve this, the ELCOSINT partners have developed an innovative material specifically designed to provide an alternative for high Pb content materials and further increase the operating temperature of electronic assemblies whilst maintaining standard SMT production.  These materials be suitable for operating at temperatures above 250oC, a current road block for high temperature interconnects e.g. SiC applications.

Project Outcomes