The future of high temperature interconnect

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Over the last 3 years the project partners Microsemi, National Physical Laboratory (NPL) and Gwent Electronic Materials (GEM) have worked in collaboration to successfully develop innovative materials specifically designed to offer an alternative for high Pb content materials to further increase the operating temperature of electronic assemblies. These materials will be suitable for operating at temperatures above 250oC utilising standard manufacturing processes which until now have been a road block for high temperature interconnects in, for example, SiC applications.

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Our Partners

MicrosemiGwent Group - Advanced Material GroupNPL - National Physical Laboratory